| 摘要 |
The present invention is a chip scale package handling part and process manufacturing method that uses existing automated equipment to economically mass produce chip scale packages. The present invention includes a unitary substrate panel having a plurality of die attach areas thereon for forming chip scale packages. The substrate panel has indexing holes formed therein so that the substrate panel is capable of being indexed by lead frame handling equipment. The lead frame handling equipment indexes the substrate panel through chip scale package fabrication machinery, where the chip scale package fabrication machinery is compatible for indexing lead frames therethrough. Examples of the chip scale package fabrication machinery include die attach machinery and wire-bonders. Conductive contacts are attached to the bottom portion of the substrate panel and the substrate panel is singulated to form a plurality of separated chip scale packages. The chip scale packages are preferably encapsulated for protection.
|
