发明名称 |
Method of improving adhesion of cap oxide to nanoporous silica for integrated circuit fabrication |
摘要 |
A method of improving adhesion of a cap oxide to nanoporous silica for integrated circuit fabrication. In one embodiment, the method comprises several steps. The first step is to receive a wafer in a deposition chamber. Then a porous layer of material is deposited on the wafer. Next, a portion of the porous layer is densified in order to make it more compatible for adhesion to a cap layer. Finally, a cap layer is deposited onto the porous layer.
|
申请公布号 |
US6418875(B1) |
申请公布日期 |
2002.07.16 |
申请号 |
US20010902062 |
申请日期 |
2001.07.09 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V. |
发明人 |
ANNAPRAGADA RAO VENKATESWARA |
分类号 |
H01L21/316;H01L21/3205;H01L21/768;(IPC1-7):C23C16/00;H01L21/31;H01L21/469 |
主分类号 |
H01L21/316 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|