| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component handling device and a method of controlling temperature of electronic components, by which temperature control can be performed so that electronic components become substantially the temperature set for testings. SOLUTION: After a tested IC device 2 is transferred from the socket 40 of a test head 5, a pusher 30 is brought closer to or into contact with the socket 40 of the test head 5, before the next IC device 2 to be tested is transported to the socket 40, so that the pusher 30 presses the IC device 2 against the socket 40.
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