发明名称 |
Method for determining efficiently parameters in chemical-mechanical polishing (CMP) |
摘要 |
A method of determining efficiently parameters in chemical-mechanical polishing, especially a method includes a Neural-Taguchi method to seek the best parameter set to increase the quantity of output. This invention involves a time parameter to achieve end-point detection on line during the CMP procedure and also completes a maximum material removal rate (MRR) and a minimum within wafer non-uniformity (WIWNU) at the same time.
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申请公布号 |
US2003028279(A1) |
申请公布日期 |
2003.02.06 |
申请号 |
US20010826929 |
申请日期 |
2001.04.06 |
申请人 |
WANG GOU-JEN;TSAI JHY-CHERNG;CHEN JAU-LIANG |
发明人 |
WANG GOU-JEN;TSAI JHY-CHERNG;CHEN JAU-LIANG |
分类号 |
G05B13/02;(IPC1-7):G06F19/00 |
主分类号 |
G05B13/02 |
代理机构 |
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主权项 |
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地址 |
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