| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling system for an electronic device capable of suppressing a rise in the temperature of introduced air due to heat from the outside to improve cooling performance, by employing a thermal insulating structure for a path for introducing the air into a cooling device. SOLUTION: In the cooling system 1, an electronic device 3 having electronic components is accommodated, an inlet port for introducing air from a prescribed point of the external portion of the device 3 is connected, a discharging port 12 for discharging the introduced air to the outside is connected, and the device 3 is cooled using the air introduced from the port 11. The device is additionally provided with a constitution in which the port 11 of the system 1 has a thermal insulating structure, and a constitution in which a thermal radiation layer for reducing the quantity of thermal radiation incident on the surface is provided on the surface of the port 11.
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