| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser module which resists impact and vibration and is superior in reliability. SOLUTION: The module has a package 11 comprising a heat dissipation part 11a, a semiconductor laser element 14 fixed on one main surface 11as of the heat dissipation part 11a via a heat sink 13, a photosensitive element 15 for monitoring light output of the semiconductor laser element 14, a resistance element 16 for measuring a temperature of the semiconductor laser element 14, a lens 17 optically designed to collect light projected from the semiconductor laser element 14 and focus outside a window 12, an optical fiber 18 disposed to make input of light maximum at the focus, an optical isolator 19 disposed between the lens 17 and the optical fiber 18 for removing reflection return light to the semiconductor laser element 14 and a Peltier cooler 20 disposed on one main surface 11at. A surface 11s which is at the opposite side of the main surface 11at of the heat dissipation part 11a is a fixing surface.
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