发明名称 VIBRATING CHIP, METHOD FOR MANUFACTURING THE SAME, VIBRATOR, OSCILLATOR AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a vibrating chip wherein an electrode part is formed precisely and imperfection like shortcircuitting is hardly generated, the vibrating chip, a vibrator, an oscillator and an electronic apparatus. SOLUTION: This manufacturing method for a vibrating chip is provided with a metal film forming process (ST1) for forming a metal film on the vibrating chip, a photoresist layer forming process (ST2) wherein photoresist is sprayed mistwise on the metal film and a photoresist layer is formed, a photoresist pattern forming process (ST3) for forming a photoresist pattern corresponding to a forming part of the electrode part, a pattern shape adjusting process (ST4) wherein laser irradiation is performed to the photoresist pattern formed by the photoresist pattern forming process and at least a part of shape of the pattern is adjusted, an electrode forming process (ST5) wherein the metal film is eliminated by etching using the photoresist pattern as a mask and the electrode part is formed, and a photoresist pattern exfoliating process (ST6) for eliminating the photoresist pattern.
申请公布号 JP2003133875(A) 申请公布日期 2003.05.09
申请号 JP20010326501 申请日期 2001.10.24
申请人 SEIKO EPSON CORP 发明人 KITAMURA FUMITAKA;TANAYA HIDEO;SAKATA JUNICHIRO
分类号 H03B5/32;H03H3/02;H03H9/215;(IPC1-7):H03H3/02 主分类号 H03B5/32
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