发明名称 Silicon carbide semiconductor device and manufacturing method
摘要 A channel layer 4 is formed on an n--type epitaxial layer 2 and first gate areas 3, and field enhanced area(s) 5 and second gate areas 6 are formed on the first gate areas 3. Furthermore, n+-type source areas 7 and a third gate area 8 are formed on the second gate areas 6. These steps result in a device structure having a first J-FET with the n+-type source areas 7 and the n+-type substrate 1 as a source and drain and the first gate areas 3 at the right and left in the figure as a gate; and the second J-FET with the n+-type source areas 7 and the n+-type substrate 1 as a source and drain and the second gate areas 6 and the third gate area 8 as a gate. The first J-FET is normally-on, while the second J-FET is normally-off.
申请公布号 US6576929(B2) 申请公布日期 2003.06.10
申请号 US20020135522 申请日期 2002.05.01
申请人 DENSO CORPORATION 发明人 KUMAR RAJESH;SUZUKI TAKAMASA
分类号 H01L21/04;H01L21/337;H01L29/24;H01L29/772;H01L29/80;H01L29/808;(IPC1-7):H01K29/78;H01K31/028 主分类号 H01L21/04
代理机构 代理人
主权项
地址