| 摘要 |
PROBLEM TO BE SOLVED: To position and arrange a plurality of conductive grains equally and quickly. SOLUTION: Air is sucked through respective through holes 12a of an adhesive film 12 while adsorbing the adhesive film 12 by an adsorption head 13. Respective conductive grains 14 in a tray 15 are arranged by adsorbing the respective conductive grains 14 to respective through holes 12a of the adhesive film 12 on the adsorption head 13 while vibrating respective conductive grains 14 in the tray 15 to position and array the same grains 14 on the adhesive film 12 evenly and quickly by this method. On the other hand, the adhesive film 12 on the adsorption head 13 is pushed against a forcing stage 31 to force respective conductive grains 14 into respective through holes 12a of the adhesive film 12 and prevent drop-outs of the same grains 14. Thereafter, the adsorption of the adhesive film 12 by the adsorption head 13 is stopped and the adhesive film 12 is released from the adsorption head 13. COPYRIGHT: (C)2003,JPO
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