| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device for exfoliation of a thin film capable of effectively and stable inspecting bonding strength of a back electrode layer without vacuum sucking the surface of a semiconductor substrate, i.e., without damaging a circuit pattern. SOLUTION: There are provided a vacuum chuck 3 serving as holding means for vacuum sucking and holding a back surface peripheral section of a semiconductor substrate 2 on the surface of which a circuit pattern is formed, a sticking roller 6 serving as sticking means for pressing an adhesive tape 4 on a back surface electrode layer 2a of the semiconductor substrate 2 along a guide rail 5 and sticking the adhesive tape to the back surface electrode layer, a slide section 8 serving as exfoliation means for exfoliating the adhesive tape 4 by hooking the tip end of a hook 7 and a base. COPYRIGHT: (C)2004,JPO
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