Wafer cleaning system

摘要

Embodiments of the invention include a megasonic energy cleaning apparatus that has the ability to rotate the wafer to be cleaned, as well as rotate the cleaning probe during the cleaning process. Rotating the cleaning probe while the wafer is being cleaned is effective to increase the cleaning action of the apparatus while also minimizing damage to the wafer. Curved grooves, such as a spiral groove, can be etched into the cleaning probe to minimize forming harmful waves that could potentially cause damage to the wafer surface or to structures already made on the surface. Using a cleaning probe having a curved groove while also rotating the cleaning probe effectively cleans particles from a wafer while also limiting damage to the surface of the wafer.