| 发明名称 |
The use of a solder on surfaces coated with nickel by electroless plating |
| 摘要 |
A solder (6), used for soldering to surface coated with nickel by electroless plating using phosphorous-containing plating solution, comprises (by mass%) 60-64% tin, 0.002-0.01% phosphorus, 0.04-0.3% copper and lead. |
| 申请公布号 |
EP1402988(A1) |
申请公布日期 |
2004.03.31 |
| 申请号 |
EP20030292348 |
申请日期 |
2003.09.25 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
NOZAWA, IWAO;HORI, TAKASHI;SOUMA, DAISUKE;ROPPONGI, TAKAHIRO |
| 分类号 |
B23K35/24;B23K1/00;B23K35/02;B23K35/26;B32B15/01;C22C13/00;H01L23/12;H05K3/24;H05K3/34 |
主分类号 |
B23K35/24 |
| 代理机构 |
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代理人 |
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