| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method by which a ceramic wiring board that is thinned in wiring and lowered in resistance can be manufactured at high yield. <P>SOLUTION: This method of manufacturing the ceramic wiring board includes a step of forming a first ceramic green sheet 1a having through-conductor sections 2 formed by filling up the through holes of the sheet 1 with a first conductor component, and a step of forming through sections 6 in the form of a wiring circuit pattern by removing the portions of a wiring circuit pattern through development after a photosensitive ceramic green sheet 4 formed on a substrate 3 for transfer is exposed. This method also includes a step of forming a second ceramic green sheet 4a having a wiring circuit section 7 by filling up the through sections 6 with a second conductor component, a step of transferring the second ceramic green sheet 4a onto the first ceramic green sheet 1a, and a step of laminating a plurality of first ceramic green sheets 1a to which the second ceramic green sheet 4a is transferred upon another and firing the laminate. <P>COPYRIGHT: (C)2004,JPO</p> |
