| 摘要 |
PROBLEM TO BE SOLVED: To prevent enlargement of a cutting device caused by increase in diameter of a workpiece and enable adjustment and maintenance of cutting means thereby improving the productivity in the cutting device for cutting the workpiece such as a semiconductor wafer.SOLUTION: A first cutting unit 5 including first cutting means 51 and second cutting means 52 and a second cutting unit 6 including third cutting means 61 and fourth cutting means 62 are made movable along a Y-axis guide rail 70 arranged on an upper surface of a gate type support frame 4, and spindles forming the respective cutting means are arranged in parallel with each other at an opening 42 of the gate type support frame 4 in a hanging state. This improves the rigidity without enlarging a cutting device and facilitates position adjustment and maintenance to shorten the time required for these kinds of operations. Further, the cutting device includes the four cutting means and thus improves in productivity of cutting work. |
