| 摘要 |
A low resistance magnetic tunnel junction device, such as a memory cell in a nonvolatile magnetic random access memory (MRAM) array or a magnetoresistive read head in a magnetic recording disk drive, has a titanium oxynitride (TiOxNy) layer as the single-layer tunnel barrier or as one of the layers in a bilayer tunnel barrier. In a bilayer barrier the other barrier layer is an oxide or nitride of Al, Si, Mg, Ta, [[Si]] and Y, such as Al2O3, AlN, Si3N4, MgO, Ta2O5, TiO2, or Y2O3. The Ti barrier material can be alloyed with other known metals, such as Al and Mg, to produce barriers with TiAlOxNy and TiMgOxNy compositions.
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