发明名称 |
Package of electronic components and method for producing the same |
摘要 |
An electronic component package (106) includes: at least one electronic component (101); a wiring provided with a terminal portion (102) with which the electronic component (101) is connected electrically; and a resin portion (105) that covers at least a part of the electronic component (101) and is for bonding the wiring. A part of the wiring extends by way of an edge of the package (106) so as to be formed on a surface and a rear face of the package. With this configuration, wirings can be formed freely on the surface of the package without using a flexible board, and input and output terminals (102, 104) from the electronic component can be arranged on the surface and the rear face of the package. <IMAGE> |
申请公布号 |
EP1447845(A2) |
申请公布日期 |
2004.08.18 |
申请号 |
EP20040002622 |
申请日期 |
2004.02.06 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HIGASHITANI, HIDEKI |
分类号 |
H01L23/31;H01L23/495;H01L23/538;H01L25/10 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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