发明名称 Package of electronic components and method for producing the same
摘要 An electronic component package (106) includes: at least one electronic component (101); a wiring provided with a terminal portion (102) with which the electronic component (101) is connected electrically; and a resin portion (105) that covers at least a part of the electronic component (101) and is for bonding the wiring. A part of the wiring extends by way of an edge of the package (106) so as to be formed on a surface and a rear face of the package. With this configuration, wirings can be formed freely on the surface of the package without using a flexible board, and input and output terminals (102, 104) from the electronic component can be arranged on the surface and the rear face of the package. <IMAGE>
申请公布号 EP1447845(A2) 申请公布日期 2004.08.18
申请号 EP20040002622 申请日期 2004.02.06
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HIGASHITANI, HIDEKI
分类号 H01L23/31;H01L23/495;H01L23/538;H01L25/10 主分类号 H01L23/31
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