| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which is excellent in fillability and is suitable as an underfill material for flip chip packaging, and a flip chip-packaged semiconductor device sealed with the same which has a good reliability in terms of molding failure such as voids, reflow resistance, humidity resistance, etc. <P>SOLUTION: The epoxy resin molding material for sealing contains at least (A) an epoxy resin, (B) a hardener and (C) an inorganic filler. The (C) inorganic filler has an average particle size of≤15μm and a specific surface area of 3.0-6.0 m<SP>2</SP>/g. The molding material is used for the semiconductor device having at least one component chosen from (a1) a flip chip having a bump height of≤150μm, (b1) a flip chip having a bump pitch of≤500μm, (c1) a semiconductor chip having an area of≥25 mm<SP>2</SP>and (d1) a sealing material having a total thickness of≤2 mm. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
