| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate cutting method and device by which products (packages 5) can be efficiently produced from various sealed substrates 1 by solving various problems in the cutting of a substrate and the productivity of products can be improved. SOLUTION: Before mounting a sealed substrate 1 on which cutting portion patterns are previously aligned on an alignment stage B formed on the substrate cutting device independently of a cutting stage C to the cutting stage C, the prescribed number of markers 6 is searched, the sealed substrate 1 is mounted on the cutting stage C and then the sealed substrate 1 is cut off along the cutting portions 4 to separately form individual packages 5. COPYRIGHT: (C)2005,JPO&NCIPI |
