| 摘要 |
PURPOSE: A wire bonding apparatus is provided to detect the bonding force between a capillary and a wire bonding surface, thereby controlling the bonding force by using a bonding force detection unit. CONSTITUTION: A wire bonding apparatus comprises a capillary(100), a transducer(102), a transducer holder(104), and a bonding head body(106). The wire bonding apparatus further comprises a pre-load module(108) installed on the transducer holder and a force sensing unit(100) installed on the bonding head body adjacent the pre-load module. The pre-load module transfers the deflection of the transducer and the force sensing unit inverts the deflection of the transducer into an electric signal. |
