METHOD FOR MANUFACTURING CONTAINER FOR PLASTIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a container for a plastic package constituted so that a lead frame is stably fixed even if there is the inflow of a resin when molding and the upper surface of the lead frame is sufficiently exposed, good in airtightness or the like because there is no unfilled resin part and capable of connecting a semiconductor, a piezoelectric element or the like mounted in the container to the lead frame in an electrically stable manner. SOLUTION: The lead frame 3 bent into a zigzag shape is mounted in the cavity between a fixed mold 1 and a movable mold 2 so as to be brought into contact with the movable mold 2 under pressure on the movable mold side and held between the fixed mold 1 and the movable mold 2 under pressure on the fixed mold side. Then, a molten resin is allowed to flow in the cavity from the pin gate 11 piercing through the fixed mold 1 in the direction of the movable mold 2 to manufacture the container for the plastic package wherein the lead frame 3 is subjected to insert molding. COPYRIGHT: (C)2005,JPO&NCIPI