| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a cooling device that can effectively reduce the difference in the coefficients of linear expansion with semiconductor components and can inexpensively realize efficient cooling function, to provide a method for manufacturing the wiring board, and to provide a component-packaged wiring board having the cooling device which uses the wiring board. SOLUTION: The wiring board having the cooling device comprises a wiring board having a packaging section for packaging semiconductor parts on a packaging side main surface; and the cooling device that sets a main surface at a side opposite to the packaging section of the semiconductor parts to be packaged to the packaging section as a surface to be cooled, has a cooling section body arranged on the surface to be cooled, and forms the channel for cooling the fluid inside the cooling body. The cooling body of the cooling device is connected to the packaging side main surface of the wiring board via a fixation section, and a part including at least the packaging side main surface of the wiring board, the cooling body, and the fixation section are made of ceramic materials. COPYRIGHT: (C)2005,JPO&NCIPI |
