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发明名称
电子元件,安装构造体,光电装置及电子机器
摘要
〔课题〕目的在于提供一种冗长性佳之电子元件。〔解决手段〕介由主动面上形成之焊垫24导电连接于对象侧基板的电子元件121,藉由主动面上形成之树脂突起12,与树脂突起12之表面形成之导电膜20构成凸块电极10,对一个焊垫24导电连接有多数个凸块电极10a、10b为其特征。
申请公布号
TW200535921
申请公布日期
2005.11.01
申请号
TW094111058
申请日期
2005.04.07
申请人
精工爱普生股份有限公司
发明人
斋藤淳;田中秀一
分类号
H01L21/00
主分类号
H01L21/00
代理机构
代理人
林志刚
主权项
地址
日本
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