| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser element which can prevent laser bars from being thermally press-bonded in the case of end surface coating without using a dummy bar. SOLUTION: This semiconductor laser element includes a front surface electrode formed by Au plating, a back surface electrode formed by Au plating, an antisticking film formed only on the front surface electrode and made of a material which does not react with Au, and a coating film covering a light emitting side end face and an opposite side end face. And, the antisticking films are formed at the four corners of the front surface electrode. COPYRIGHT: (C)2006,JPO&NCIPI
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