| 摘要 |
PROBLEM TO BE SOLVED: To provide a complex, a method for manufacturing a complex, a compound sheet, a lamination and a method for manufacturing lamination components for quickly and easily forming a fine conductor, and for suppressing a lamination failure(delamination) in the lamination of a thin layer green sheet, and for improving the reliability of a wiring board. SOLUTION: A supporting plate 25 formed with a hydrophilic part 23a and hydrophobic part 23b on at least one main surface is prepared, and conductor slurry 28a containing at least metallic powder and one of hydrophilic solvent or hydrophobic solvent is applied to the main surface of the supporting plate 25 so that a conductor 29 can be formed. COPYRIGHT: (C)2006,JPO&NCIPI |
