Bonding pads with thermal pathways

摘要

Apparatuses and methods for providing thermal pathways from a substrate to a thermal bonding pad. The thermal pathways may be metal extensions of the thermal bonding pad that are disposed in channels formed in a backside passivation layer underneath the thermal bonding pad, and may be in direct contact with an underlying substrate. The thermal pathways may provide improved thermal dissipation from the substrate.

主权项

1. An apparatus, comprising:
a substrate; and an electrically-inactive bonding pad including thermally conductive pathways in direct contact with a backside of the substrate, wherein the thermally conductive pathways are disposed in channels formed in a backside passivation layer on the backside of the substrate.