| 发明名称 |
IC PACKAGING CONSTRUCTION |
| 摘要 |
PURPOSE:To reduce production cost, improve productivity and automate by forming part of lead frames thin and bonding them with IC chip projections. |
| 申请公布号 |
JPS528773(A) |
申请公布日期 |
1977.01.22 |
| 申请号 |
JP19750084677 |
申请日期 |
1975.07.10 |
| 申请人 |
CITIZEN WATCH CO LTD |
发明人 |
OONO SHIYUUJI;KOBAYASHI TOMOYOSHI |
| 分类号 |
H01L23/50;H01L21/58;H01L21/60 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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