发明名称 Aluminum-based terminal fitting
摘要 Provided are an aluminum-based terminal fitting in which a Sn layer has high peel resistance, and a terminal connecting structure of an electric wire provided with the terminal fitting. The aluminum-based terminal fitting includes a wire barrel portion (110) for connection to a conductor (210) constituted by aluminum or an aluminum alloy and provided in an electric wire (200), and a fitting portion (female fitting portion (130) or male fitting portion (140)) provided to extend from the wire barrel portion (110) and electrically connected to a separate terminal fitting. A Sn layer formed directly on a base material constituting the terminal fitting is provided on the contact region in the fitting portion.
申请公布号 US9490550(B2) 申请公布日期 2016.11.08
申请号 US201214241994 申请日期 2012.08.22
申请人 AUTONETWORKS TECHNOLOGIES, LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO WIRING SYSTEMS, LTD. 发明人 Otsuka Takuji;Hirai Hiroki;Ono Junichi;Furukawa Kingo;Munekata Teruyoshi;Ota Hajime;Nakai Yoshihiro;Nishikawa Taichiro;Kuwabara Tetsuya;Takaki Yoshiyuki;Kobayashi Hiroyuki
分类号 H01R4/10;H01R4/18;H01R4/62;H01R13/03 主分类号 H01R4/10
代理机构 代理人 Hespos Gerald E.;Porco Michael J.;Hespos Matthew T.
主权项 1. An aluminum-based terminal fitting comprising: a conductor connecting portion for connection to a conductor of an electric wire, and an electric connecting portion that is provided to extend from the conductor connecting portion and is electrically connected to a separate connection object, the aluminum-based terminal fitting having a composition that consists of a base material that is of aluminum or an aluminum alloy, and a Sn layer directly formed on the base material, the Sn layer provided on at least a contact region of the electric connecting portion; the Sn layer comprising an immersion-plated layer having a thickness of 0.05 μm to 0.3 μm carried directly by the base material, and an electroplated layer having a thickness of 0.25 μm to 1.7 μm carried directly by the immersion-plated layer.
地址 Yokkaichi-shi, Mie JP
您可能感兴趣的专利