发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To shorten bonding time and increase bonding strength by adding plural kinds of dissimilar materials to the part where a fine metal wire is to be bonded thereby reducing the difference in hardness, in wire-bonding by means of ultrasonic waves.
申请公布号 JPS5287361(A) 申请公布日期 1977.07.21
申请号 JP19760003823 申请日期 1976.01.16
申请人 发明人
分类号 H01L21/607;H01L21/48;H01L21/60 主分类号 H01L21/607
代理机构 代理人
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