SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

The present invention provides a semiconductor device having a structure easy to stack and a method for manufacturing the same. According to an embodiment, the semiconductor device comprises: a plate made of metal and divided into at least two regions; a semiconductor die formed in one region of the plate; an insulating layer formed to cover the semiconductor die; and a rewiring layer electrically connected to the plate or a bond pad of the semiconductor die through a via of a first insulating layer, wherein the insulating layer is formed to fill a gap between the divided regions of the plate.