| 摘要 |
PURPOSE:To obtain satisfactory bonding by using a sheet-form bonding agent consisting of a resin containing a filling substance of prescribed size and having a melting point higher than the normal temperature. CONSTITUTION:A sheet-form bonding agent 21, consisting of a resin containing a filling substance of prescribed size and having a melting point higher than the normal temperature, is formed into a prescribed size and it is placed on a tab 22. Then, a semiconductor pellet 24 is placed on an adhesive agent 21, and this adhesive agent is hardened by heating in the pressed down condition. Next, the electrode on the upper surface of the pellet and the reed piece 23 are connected. In this case, as the thickness of the bonded layer is defined by the size of the filling substance, a uniform thickness can be obtained, and exfoliation and cracking of the bonded layer and cracking of the semiconductor pellet can be prevented. |
