| 摘要 |
PURPOSE:To provide a semiconductor device wherein conductors are provided to extend through an insulating casing such that two conductors for inputting and outputting are extremely projected from the casing, so that the number of input/output signals per unit area of the casing is increased and the insertion into the board is facilitated. CONSTITUTION:Latticed conductors 17 which penetrate an insulating surrounder member 10 are provided and soldering 11 is made at the surface of an armor. Pins are used for an grounding terminal 12 and a power terminal 13. Semiconductor chips 19 are fixed on the surrounder 10 to connect 18 the conductors 17. A multilayer distributing board 14 is provided with clear holes 16 correspond to the conductors 17 and the holes are connected to an inner layer conductor 20 by through hole plating. Position is made for pins 12, 13 by inserting the pins into the corresponding holes and melting solder is poured into the holes 16 from the rear side of the multilayer distributing board to connect solder 11. Connection to micro packages having many input and output signals will be performed with high reliability by the conductors arranged in a latticed state. Furthermore, the connection is surely made only by inserting a few pins and the efficiency is very high. |
