| 摘要 |
PURPOSE:To obtain a stabilized bonding at all times even when a heavy wire is used by a method wherein the wire is cut by applying an ultrasonic wave oscillation and by observing the bonding condition at the same time. CONSTITUTION:The wire 4 is pressed against a sample 1 and an ultrasonic wave is applied on it. When the wire is contacted to the sample, the current which conducts a resistor 8 is decreased, the wire is crushed after passing a fixed value A1 causing the current to decrease still more. The wire is clamped 4 and cut at the current ?value A1. The waveform of the current through the resistor 8 is shaped 9 and AD convered 10, and it is inputted to the RAM13 of a microcomputer 12 through a control circuit 11. These informations are analyzed and when the stabilized current A1 is conducting, the wire is clamped 4 and cut through a control section for bonding device 14. At the same time, a command is given to a power source 6, a more larger oscillation ouput is turned out so that the cutting of the wire can be performed easily. With this constitution, a stabilized bonding can be performed at all times even when a heavy wire is used. |
