| 摘要 |
PURPOSE:To decrease force functioning to a flat lead frame by mounting a roller to a contacting surface of an upper base with the lead frame when a semiconductor device to which the lead frame is welded is placed on a lower base, the upper base is moved downward and contacted with the lead frame and the lead frame is bent and formed. CONSTITUTION:A semiconductor pellet 2 glued onto a ceramic base 3 and a semiconductor device 10 welded onto a lead frame under a flat condition are set onto a lower base 5, and an upper base 6 is moved downward. A pair of rollers 9 mounted to the upper base 6 are contacted with the lead frame 1 from an upper section at that time. When the rollers are further moved downward, they bend the lead frame downward while rolling, and bend form the lead frame in a shape being along the lower base 5. Thus, the bending and forming of the lead frame, which cause no glass clack and exfoliation, can be conducted, and reliability is increased. |
