发明名称 ASSEMBLING METHOD FOR PRESSURE CONTACT TYPE SEMICONDUCTOR DEVICE WITH CONTROL ELECTRODE TERMINAL
摘要 <p>PURPOSE:To improve the workability of assembling a thyristor and to prevent the damage of a controlling electrode of assembling a spring lead formed of an elastic member with the first main electrode terminal of a package and simplifying the conrolling electrode pressing mechanism. CONSTITUTION:In the step of assembling, for example, a thyristor, a gate spring lead 3a is inserted into a gate terminal 27 from the notch 26 of a cathode terminal 24 mounted at a package 2. Then, a lead pressing part 31 is inserted into an insulating support 5 provided with a lateral groove 52, is engaged with the recess 25 of the cathode terminal 24, and a cathode pressing plate 7 is placed. After an element 1 is inserted to contact the gate electrode 16 with the lead pressing part 31a, an anode terminal 8 is pressed to the anode supporting plate 18 of the element 1, a lead 3a is pressed down to press the cathode 17 to the plate 7, and the package is soldered and sealed. Thus, the gate pressing mechanism can be simplified with less number of parts, thereby facilitating the assembling work and improving the workability. Further, it can facilitate the positioning, thereby preventing the damage of the gate electrode.</p>
申请公布号 JPS57103343(A) 申请公布日期 1982.06.26
申请号 JP19810175321 申请日期 1981.10.30
申请人 MITSUBISHI DENKI KK 发明人 OOKATA MITSUO
分类号 H01L21/52;H01L21/60;H01L23/04;H01L23/48 主分类号 H01L21/52
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