| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which suppresses increase in material cost of a sintering bonding material and achieves high quality bonding.SOLUTION: A semiconductor device manufacturing method according to the present embodiment comprises: (a) a process of arranging a sheet-form sintering bonding material 2a on a substrate (insulating substrate 3); (b) a process of arranging a semiconductor element 1 on the bonding material 2a after the process (a); and (c) a process of sintering the bonding material 2a by applying pressure between the substrate and the semiconductor element 1. The bonding material 2a contains fine particles of Ag or Cu, and the fine particles are wrapped by an organic film.SELECTED DRAWING: Figure 1 |
