BLANK AND PROCESS FOR THE FORMATION OF BEAM LEADS FOR IC CHIP BONDING

摘要

BLANK AND PROCESS FOR THE FORMATION OF BEAM LEADS FOR IC CHIP BONDING A three-layer blank and a process are disclosed for the formation of frames of metal beam leads that are bonded to integrated circuit chips. The blank incorporates an improved negative-working resist having adhesion to the metal as well as flexibility. The process of forming the leads includes the step of fully photopolymerizing the resist to avoid outgassing of residual monomer as would otherwise occur during bonding.