| 摘要 |
PURPOSE:To select base materials for a heat dissipating plate in response to the power consumption of a semiconductor device, and to give the combination of the heat dissipating plate and a lead frame the degree of freedom by separately preparing the lead frame and the heat dissipating plate and bonding them. CONSTITUTION:An insulating substrate in which a copper foil is pasted on an aluminum plate or a copper plate by employing insulating adhesives 12 such as an epoxy group insulator is used, a pattern having an area 13 for loading a semiconductor element is formed through etching, and an insulating type heat dissipating plate 11' having a desired shape is obtained. On the other hand, a lead frame to which a chip mounting land 16 for loading the semiconductor element is formed is shaped, and bent so as to have a stepped section with an outer lead 1. The chip mount land 16 is bonded with the area 13 through soldering 2', thus acquiring an insulating type lead frame with the heat dissipating plate. The lead frame is wired by using a bonding wire 4, and sealed with a resin 5. The heat dissipating plate 11' is insulated from the semiconductor element 3 by the insulating layer 12. |
