发明名称 LEAD WIRE FORMING APPARATUS FOR INTEGRATED CIRCUIT ELEMENT
摘要 PURPOSE:To insert the lead wire easily into a printed circuit board without using a jig by setting the width of a pair of rails to the width between the lead wires and then bending the width of lead wire to the hole width of printed circuit board. CONSTITUTION:After the lead wire width of IC element and hole width of printed circuit board are set, width of rails 22, 23 is determined by a width adjusting screw 12 and then width of rails 22, 23 is fine adjusted by the fine adjusting screw 16. When a motor is driven, a forming roller 7 rotates and when the lead wire of IC element moves to the width adjusting part, the lead wire is adjusted to the width and angle preset to the hole of printed circuit board. Thereafter the lead wire passes this adjusting part and is then sent to the IC case. According to this apparatus, the lead wire is manufactured to the width which is a little larger than the minimum width of printed circuit board for insertion to be inserted and the bending part is formed to the width which is a little larger than the maximum hole width of printed circuit board. Therefore, the lead wire can be inserted into the hole of the printed circuit board without using a jig and the working efficiency can be as much improved for insertion of lead wire.
申请公布号 JPS6089947(A) 申请公布日期 1985.05.20
申请号 JP19830198568 申请日期 1983.10.24
申请人 MEISHIYOU KK 发明人 FURUYA HARUMI
分类号 H01L23/50;H01L21/48 主分类号 H01L23/50
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