| 摘要 |
PURPOSE:To obtain the titled device of good appearance with a small number of voids by a method wherein a semiconductor element assembled structure is arranged in a cavity constituting a resin sealing metal mold, and, in resin sealing by pressing the material of epoxy resin therein, the amount of water is specified to less than 0.1wt%. CONSTITUTION:The bottom of the resin-sealing upper metal mold 10 is provided with the cavity 2, and the surface of the lower metal mold 11 is provided with the cavity 2; besides, a pot 1 is bored at the center of the lower metal mold 11, where a plunger 5 is inserted from the under side. The semiconductor device assembled structure 6 consisting of a semiconductor element 6a and an outer lead 6b is arranged in the cavity 2 positioned by such a construction of metal molds, and the epoxy resin material 4 filling the pot 1 is pushed up by a plunger 5 and then pressed to feed into the cavities 2 via gate 3, resulting in the sealing of the structure 6 with the material 4. At this time, the material 4 in tablet form melted on heating is previously dried so that its amount of water becomes less than 0.1wt%, thereby inhibiting the generation of voids due to steam. |
