Electronic chip-carrier heat sinks

摘要

Dissipation of heat from a socketed leadless electronic chip- carrier package 7 is promoted by a heat-conducting metal socket cap 6 of a unitary construction which both mechanically holds the package 7 securely mated with a multi-pin socket 8 and also cools the package by way of an integrated array of heat-radiating elements 6H, 6I, 6J and 6K. Edge clasping of the cap 6 with the socket 8 avoids interference with conduction of heat away from central areas of the package and cap.