| 摘要 |
PURPOSE:To improve moisture resistance and to improve the long reliability by reducing the specific weight of a filler contained in a sealing resin composition smaller than a sealing resin, and separating the filler from the surface of wirings of a semiconductor element at resin-sealing time by utilizing buoyancy of the filler. CONSTITUTION:The surface of wirings of a semiconductor element 1, i.e., the surface formed with a passivation film 7 is disposed upside with respect to the gravity direction, and sealed with resin composition made of epoxy resin 8, and filler 9 having a specific weight smaller than the epoxy resin. The resin 8 is in melted state, the filler 9 presented in the upper half of the resin 8 is separated from the film 7 on the wiring surface of the element 1, the filler 9 is protruded from the film 7, but does not arrive as the aluminum wirings 4. |
