| 摘要 |
PURPOSE:The copolymer excellent in low-temperature moldability, heat resistance and flexibility, comprising tetrafluoroethylene, vinylidene fluoride and hexafluoropropylene each in a specified proportion. CONSTITUTION:45-60mol% tetrafluoroethylene is copolymerized with 20-40mol% vinylidene fluoride and 15-35mol% hexafluoropropylene at 0-150 deg.C and a pressure of 0-50kg/cm<2>G in the presence of a radical polymerization initiator (e.g., ammonium persulfate) to obtain a fluorine-containing copolymer having a molding temperature of 250-350 deg.C, a volume resistivity of 10<14>-10<17>OMEGA.cm, a dielectric constant of 4-7 (at 1kHz), and a dielectric loss <=0.02 (at 1kHz).
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