| 摘要 |
PURPOSE:To connect a pellet for a semiconductor device and a wiring section electrically by using a copper wire without generating the breaking and insufficient strength of a passivation film by making copper having specific purity to be contained in a bonding wire. CONSTITUTION:For bond a bonding wire 6, a ball section 6a is formed at the tip of the wire by discharge between the tip of the wire 6 held by a wire bonder and an electrode 9 for the wire bonder. The ball section 6a is pushed against the upper section of an aluminum pad 5 on a pellet 3 by employing an ultrasonic bonding tool 10, and bonded firmly by ultrasonic vibrations. The bonding wire 6 is refined at high purity of purity of 99.999wt% or more through a zone refining method or electrolysis, and consisting of copper through which the micro- Vickers hardness of the ball section is controlled to MHv=35-65 (in 5g.f). The copper wire is brought to hardness at a numerical value required, thus bonding the ball without breaking a passivation film on the pellet 3, then acquiring the wire having sufficient strength. |
