发明名称 MOLD FOR RESIN SEALING
摘要 PURPOSE:To uniformize the temperature distribution of the whole mold and consequently prevent molded resins from generating strain by a structure wherein a high thermally conductive member such as a metal plate, a metal rod or the like, the thermal conductivity of which is better than that of a cavity clock, is provided at least on the surface of a mold consisting of a top force and a bottom force. CONSTITUTION:A heat transfer member 24 consisting of a sheet of copper, the thermal conductivity of which is better than that of iron, is provided on the top surface of a bottom force 21 of a mold excluding the portion contacting with an opening 23, through which resin is poured under pressure. In addition, iron cavity blocks are connected onto the top surface of the bottom force. By the structure as mentioned above, both the heat of molten resin and the heat generated by heaters 25 imbedded in the bottom force 21 are transferred more rapidly than before the the wide region of the bottom force 21 of the mold. This removes the phenomena that the temperature at the peripheral part of the bottom force 21 of the mold is lower than that at its central part and the temperature distributions of the cavity blocks connected to the mold become uniform.
申请公布号 JPS62207615(A) 申请公布日期 1987.09.12
申请号 JP19860050887 申请日期 1986.03.07
申请人 FUJITSU LTD 发明人 SANO YOSHIAKI
分类号 H01L21/56;B29C45/26;B29C45/73 主分类号 H01L21/56
代理机构 代理人
主权项
地址