发明名称 Electronic equipment and flexible printed circuit
摘要 A shield layer is selectively formed on a front surface of a base film having an insulating property to form a wiring layer on a rear surface of the base film, and a connector connection terminal and a mounting terminal are selectively provided on the wiring layer. A liquid crystal display device is configured so as to be housed in a set housing, in a state that a TFT array substrate and a control board are connected to each other via an FPC having the structure as described above. In this case, the shield layer is provided in such a manner of opposing to an inner surface of the housing, the shield layer maintains an insulating relationship with the drive circuit, and is electrically connected to a portion of the housing via the first ground wiring portion.
申请公布号 US9532491(B2) 申请公布日期 2016.12.27
申请号 US201314102228 申请日期 2013.12.10
申请人 Mitsubishi Electric Corporation 发明人 Hashido Ryuichi
分类号 H05K9/00;G02F1/133;H05K1/02;G02F1/1345;H05K3/36;G02F1/1333 主分类号 H05K9/00
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. Electronic equipment comprising: a first substrate on which a drive circuit driving a drive target is mounted; a second substrate on which a control circuit imparting a control signal for said drive circuit is mounted; a flexible printed circuit having a first connecting portion connected to said first substrate, a second connecting portion connected to said second substrate, and internal wiring, the flexible printed circuit connecting between said first and said second substrates such that said drive circuit can be controlled by said control signal from said control circuit via the internal wiring; and a housing that houses said first and said second substrates, and said flexible printed circuit therein, wherein said second substrate further has a first ground wiring portion formed independently from said control circuit, said flexible printed circuit has a shield layer having conductivity and being electrically independent from said internal wiring at a first main surface side, and a wiring layer provided with said internal wiring at a second main surface side, said shield layer is provided in such a manner of opposing to an inner surface of said housing, said shield layer maintains an insulating relationship with said drive circuit, and is electrically connected to a portion of said housing via said first ground wiring portion, and said shield layer is separated from said first substrate by an insulation distance greater than 0 to thereby prevent any electrical connection between said shield layer and said first substrate.
地址 Tokyo JP