发明名称 | Power conversion device | ||
摘要 | A power conversion device capable of reducing a temperature variation between a plurality of semiconductor modules is provided. The power conversion device comprises condensers 121, 122, a plurality of semiconductor modules 101, 102, heat dissipation units 103 to 109, a bus bar 140 connecting the condensers 121, 122 with the plurality of the semiconductor modules 101, 102, and a ventilation unit having cool wind blow. The power conversion module has features that the plurality of semiconductor modules 101, 102 are arranged apart from the condensers 121, 122 and in a line in a longitudinal direction of the bus bar 140 and that the cool wind 150 blows in a direction from the condensers 121, 122 toward the plurality of semiconductor modules 101, 102 that are mounted. | ||
申请公布号 | US9532489(B2) | 申请公布日期 | 2016.12.27 |
申请号 | US201514750302 | 申请日期 | 2015.06.25 |
申请人 | Hitachi, Ltd. | 发明人 | Mabuchi Yuuichi;Kawashima Tetsuya;Matsumoto Daisuke;Mima Akira;Hattori Yukio;Kamizuma Hiroshi |
分类号 | H05K7/20 | 主分类号 | H05K7/20 |
代理机构 | Crowell & Moring LLP | 代理人 | Crowell & Moring LLP |
主权项 | 1. A power conversion device comprising: a condenser; a plurality of semiconductor modules; a heat dissipation unit for cooling the plurality of the semiconductor modules collectively; a bus bar connecting the condenser with the plurality of semiconductor modules; and a ventilation unit emitting a cooling wind flow; wherein the plurality of semiconductor modules are arranged apart from the condenser and in a line along a longitudinal direction of the bus bar, and the cooling wind flows in a direction from a first region where the condenser is mounted toward a second region where the plurality of semiconductor modules that are mounted, the first region being hotter than the second region. | ||
地址 | Tokyo JP |