发明名称 COOLING DEVICE FOR ELECTRONIC PART
摘要 PURPOSE:To improve the workability of a cooling device in case of fitting an electronic part therewith by a method wherein a heat conductive member conducting the heat generated by a package to a radiating member is made of an elastic material while a recession fixing the radiating member is provided on the upper part of heat conductive member. CONSTITUTION:A heat conductive member 1 is provided with a recession conforming to the shape of a radiating menber 3 and a U-shape recession holding an electronic part 2 mounted on a print substrate 4. An elastic material such as silicon rubber etc. is applicable to the heat conductive member 1. The heat conductive member 1 made of such an elastic material can easily hold the radiating member 3 and the electronic part 2 by simply inserting them into respective recessions without using any bonding agent or screws etc. while securely fixing the radiating member 3 and the electronic part 2 by the elastic pressure of heat conductive member 1 put thereon.
申请公布号 JPS62256463(A) 申请公布日期 1987.11.09
申请号 JP19860097920 申请日期 1986.04.30
申请人 HITACHI LTD 发明人 IMAI TOSHIO
分类号 H01L23/36;H01L23/367 主分类号 H01L23/36
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