发明名称 |
CONDUCTIVE PASTE FOR GLASS SUBSTRATE, METHOD FOR FORMING CONDUCTIVE FILM, AND SILVER CONDUCTIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a silver conductive film which can be fired at a low temperature of 400(°C) or lower, and is excellent in conductivity and adhesiveness to a glass substrate; a method for forming the same; and a conductive paste used for the same.SOLUTION: A conductive paste has such a paste composition that a ratio of a resin and silver is 12% or less and a ratio of the resin and a solvent is 35% or less using silver powder having an amount of rosin to be deposited of 1.6% or less and a particle size of 0.5 μm or less, and thereby is subjected to a firing treatment at a temperature in a range of 300-370°C to produce a silver conductive film 10 which has such good conductivity that a sheet resistance value is approximately 2-6 mΩ/square and has high adhesiveness to a glass substrate 12.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016196391(A) |
申请公布日期 |
2016.11.24 |
申请号 |
JP20150078077 |
申请日期 |
2015.04.06 |
申请人 |
NORITAKE CO LTD |
发明人 |
SAKAI AKIHIRO;NAKAYAMA KAZUTAKA;NUMAGUCHI MINORU |
分类号 |
C03C8/18;C03C8/16;C23C26/00 |
主分类号 |
C03C8/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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