| 摘要 |
<p>PCT No. PCT/JP85/00071 Sec. 371 Date Sep. 24, 1985 Sec. 102(e) Date Sep. 24, 1985 PCT Filed Feb. 20, 1985 PCT Pub. No. WO85/03670 PCT Pub. Date Aug. 29, 1985.A heat-resistant resin molded article excellent in abrasion resistance, surface smoothness, solvent resistance, durability and adhesiveness between base material and cured film, consisting of (1) a resin molded article composed of 2% by weight or more of a structural unit represented by the following structural formula <IMAGE> (wherein R is a hydrogen atom, an alkyl group, an aryl group or an alicyclic group of 1 to 20 carbon atoms) and 98% by weight or less of an ethylenic monomer unit and (2) a cured film formed on the surface of said resin molded article by curing a crosslinking-curable resin material containing 30% by weight or more of at least one monomer having three or more (meth)acryloyloxy groups in one molecule, as well as a process for producing said heat-resistant resin molded article.</p> |
