| 摘要 |
PURPOSE:To execute a high-accuracy alignment operation even when a semiconductor device substrate has been curved or deformed by a method wherein a microscope is constituted so as to be able to observe a photomask and alignment marks formed in the central part, at the upper part and the lower part of the semiconductor device substrate and the posture of a carriage when the marks have been aligned at the lower part can be stored. CONSTITUTION:The following are installed: a carriage 13 which can be moved toward and backward along guides 12 installed at a base 11 and whose posture is controlled by using air pads 14 and the like; reflection and projection type optical systems 15-17 which execute an exposure operation between a photomask 2 mounted on the carriage and a semiconductor device substrate 1; microscopes 18a-18c which are arranged at the upper part of the carriage 13 and observe the photomask 2 and individual alignment marks of the semiconductor device substrate 1. The microscopes 18a-18c are constituted so as to be able to observe the photomask 2 and the alignment marks formed in the central part, at the upper part and the lower part of the semiconductor device substrate 1; this aligner is constituted in such a way that the posture of the carriage 13 when the marks at least at the upper part and the lower part are aligned at the lower part can be stored by using, e.g., an air pressure of each nozzle of the air pads 14 or the like. |
